Differential Reactivity

Epoxy Curatives

Epoxy resins cured with Dytek® amines have excellent properties for use in coatings, civil engineering, adhesives, marine, and composite applications.

Features Typical Applications
Dytek® A Fast curing
High toughness and flex strength
Low temperature curing
Low Viscosity
Thin film Coatings
Construction adhesives
Marine Coatings
Outdoor or refrigerated spaces
Dytek® EP Low color product
Low to no odor
Longer pot life (vs. DYTEK® A)
Low color adhesives and coatings
Electronic and electrical applications
Staged Curing
Dytek® BHMT Flexible coatings
Impact resistance
Long pot life
Road surface coatings
Soft-feel coatings
Dytek® DCH-99 Low viscosity vs. IPDA
Chemical resistance
Highest Tg of all Dytek® Amines
Tank linings with chemical exposure
High temperature applications
Wind turbine blades
High-performance composite parts

The process properties of an Epon® 828 resin cured with a stoichiometric amount of Dytek® amines, isophorone diamine (IPDA), trimethyl hexamethylenediamine (TMD), and a polyether diamine were tested for comparative purposes.

More information about the specific formulations, test conditions, and cured epoxy properties are available in the Epoxy Curing Technical Data Sheet.

Epon® is a registered trademark of Hexion Inc.  Jeffamine® is a registered trademark of Huntsman Corporation

 

Alternative to Isophorone diamine (IPDA) for Chemical Resistance

DYTEK® DCH-99 amine is a cyclic aliphatic diamine that contains a mixture of cis- and trans-isomers and is a colorless liquid at room temperature. Dytek® DCH-99 can be substituted for Isophorone diamine (IPDA) in many epoxy coating and composite applications that require high-performance chemical resistance and high Tg.

Cured Epoxy Properties

Dytek® DCH-99 IPDA
Tg, (DSC), 2nd run, °C 176 158
HDT, °C 94 97
Shore D Hardness 86 86
Izod Impact Strength, Unnotched, ft-lbf/in2 5.9 7.1
Charpy Impact Strength, ft-lbf/in2 4.8 6.9
Flexural Strength, psi X 103 12.8 12.2
Elasticity Modulus, psi X 103 439 377
Tensile Strength, psi X 103 4.4 6.4
Elongation at Break, % 2.4 2.1
Epon® 828 resin cured with a stoichiometric amount of each amine.

Compared to IPDA, Dytek® DCH-99 maintains a lower viscosity even after adduction making application easier with better leveling, flow, and smoothness in epoxy coatings and good flow and distribution in molds in epoxy composites. Dytek® DCH-99 also has a lower Hydrogen Equivalent Weight (HEW) giving more curing capability on a weight basis and better overall cost effectiveness.