Epoxy resins cured with Dytek® amines have excellent properties for use in coatings, civil engineering, adhesives, marine, and composite applications.
|Dytek® A||Fast curing|
High toughness and flex strength
Low temperature curing
|Thin film Coatings |
Outdoor or refrigerated spaces
|Low color product|
Low to no odor
Longer pot life (vs. DYTEK® A)
|Low color adhesives and coatings|
Electronic and electrical applications
|Dytek® BHMT||Flexible coatings|
Long pot life
|Road surface coatings |
|Dytek® DCH-99||Low viscosity vs. IPDA|
Highest Tg of all Dytek® Amines
|Tank linings with chemical exposure|
High temperature applications
Wind turbine blades
High-performance composite parts
The process properties of an Epon® 828 resin cured with a stoichiometric amount of Dytek® amines, isophorone diamine (IPDA), trimethyl hexamethylenediamine (TMD), and a polyether diamine were tested for comparative purposes.
More information about the specific formulations, test conditions, and cured epoxy properties are available in the Epoxy Curing Technical Data Sheet.
Epon® is a registered trademark of Hexion Inc. Jeffamine® is a registered trademark of Huntsman Corporation
Alternative to Isophorone diamine (IPDA) for Chemical Resistance
DYTEK® DCH-99 amine is a cyclic aliphatic diamine that contains a mixture of cis- and trans-isomers and is a colorless liquid at room temperature. Dytek® DCH-99 can be substituted for Isophorone diamine (IPDA) in many epoxy coating and composite applications that require high-performance chemical resistance and high Tg.
Cured Epoxy Properties
|Tg, (DSC), 2nd run, °C||176||158|
|Shore D Hardness||86||86|
|Izod Impact Strength, Unnotched, ft-lbf/in2||5.9||7.1|
|Charpy Impact Strength, ft-lbf/in2||4.8||6.9|
|Flexural Strength, psi X 103||12.8||12.2|
|Elasticity Modulus, psi X 103||439||377|
|Tensile Strength, psi X 103||4.4||6.4|
|Elongation at Break, %||2.4||2.1|
|Epon® 828 resin cured with a stoichiometric amount of each amine.|
Compared to IPDA, Dytek® DCH-99 maintains a lower viscosity even after adduction making application easier with better leveling, flow, and smoothness in epoxy coatings and good flow and distribution in molds in epoxy composites. Dytek® DCH-99 also has a lower Hydrogen Equivalent Weight (HEW) giving more curing capability on a weight basis and better overall cost effectiveness.