Epoxy Curatives
Epoxy resins cured with Dytek® amines have excellent properties for use in coatings, civil engineering, adhesives, marine, and composite applications.
| Features | Typical Applications | |
|---|---|---|
| Dytek® A | Fast curing High toughness and flex strength Low temperature curing Low Viscosity | Thin film Coatings Construction adhesives Marine Coatings Outdoor or refrigerated spaces |
| Dytek® BHMT | Flexible coatings Impact resistance Long pot life | Road surface coatings Soft-feel coatings |
| Dytek® DCH-99 | Low viscosity vs. IPDA Chemical resistance Highest Tg of all Dytek® Amines | Tank linings with chemical exposure High temperature applications Wind turbine blades High-performance composite parts |
The process properties of an Epon® 828 resin cured with a stoichiometric amount of Dytek® amines, isophorone diamine (IPDA), trimethyl hexamethylenediamine (TMD), and a polyether diamine were tested for comparative purposes.
More information about the specific formulations, test conditions, and cured epoxy properties are available in the Epoxy Curing Technical Data Sheet.
Epon® is a registered trademark of Hexion Inc. Jeffamine® is a registered trademark of Huntsman Corporation
Alternative to Isophorone diamine (IPDA) for Chemical Resistance
DYTEK® DCH-99 amine is a cyclic aliphatic diamine that contains a mixture of cis- and trans-isomers and is a colorless liquid at room temperature. Dytek® DCH-99 can be substituted for Isophorone diamine (IPDA) in many epoxy coating and composite applications that require high-performance chemical resistance and high Tg.
Cured Epoxy Properties
| Dytek® DCH-99 | IPDA | |
|---|---|---|
 |  | |
| Tg, (DSC), 2nd run, °C | 176 | 158 |
| HDT, °C | 94 | 97 |
| Shore D Hardness | 86 | 86 |
| Izod Impact Strength, Unnotched, ft-lbf/in2 | 5.9 | 7.1 |
| Charpy Impact Strength, ft-lbf/in2 | 4.8 | 6.9 |
| Flexural Strength, psi X 103 | 12.8 | 12.2 |
| Elasticity Modulus, psi X 103 | 439 | 377 |
| Tensile Strength, psi X 103 | 4.4 | 6.4 |
| Elongation at Break, % | 2.4 | 2.1 |
| Epon® 828 resin cured with a stoichiometric amount of each amine. | ||
Compared to IPDA, Dytek® DCH-99 maintains a lower viscosity even after adduction making application easier with better leveling, flow, and smoothness in epoxy coatings and good flow and distribution in molds in epoxy composites. Dytek® DCH-99 also has a lower Hydrogen Equivalent Weight (HEW) giving more curing capability on a weight basis and better overall cost effectiveness.
For fiber-reinforced polymers (FRP) composite resins, low free monomer phenolic resins, epoxy hardeners, etherified resins, waterborne dispersions and solid and solution phenolic resins, contact our sister company Georgia-Pacific Chemicals.